IEEE

Elimination of Pinhole Defects in Self-Aligned Double Patterning Process by using Bias Pulsed Plasma

Abstract: Self-aligned double patterning (SADP) is extensively utilized in advanced sub-20nm technology nodes. The DRAM digit contact SADP dry etch process experienced severe yield loss due to pinhole ...
IEEE

Adaptive Two-Stage Model for Bearing Remaining Useful Life Prediction Using Gaussian Process Regression With Matched Kernels

Abstract: Stemming from complex mechanisms and working conditions of bearings, single degradation models often fail to adequately describe complex degradation process and provide reliable prediction ...