Abstract: The requirement of trustable and precise defect detection in Printed Circuit Boards (PCBs) remains a challenge in the industrial setting. Often certain microscopic anomalies that are ...
Variation is becoming a bigger problem in multi-die assemblies with TSVs and hybrid bonding. Multi-modal approaches are required to test these devices. AI plays a role in improving defect capture rate ...
This project implements and compares two YOLOv12 object-detection pipelines for printed-circuit-board (PCB) defect identification. The objective is to detect four major defect types: ...
Printed Circuit Boards (PCBs) serve as essential carriers for mechanical support and electrical interconnection of electronic components. The detection of appearance defects is critical for ensuring ...
ABSTRACT: This study assesses the transferability of IoT solutions applied to smart waste collection in low-resource settings. In line with PRISMA guidelines, a systematic review covering the period ...
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