This new chip stacking technique could be the key to unlocking faster AI performance

Researchers developed a new chip stacking method that could quadruple AI memory density, potentially solving one of the biggest hardware bottlenecks slowing AI down today.The Latest Tech News, Deliver ...
Electronic Design

AMD Moves from HBM to LPDDR5X with New Memory-on-Package SoC

The company is replacing hard-to-find high bandwidth memory (HBM) with LPDDR5X in its latest Versal processor.

Samsung is building a dedicated AI chip for PCs, and HP and Lenovo are already testing it

According to multiple Korean outlets, including Chosun, Samsung's LSI division which works on the Exynos mobile chips, is ...
InfoQ

Comprehension at AI Speed: Building a Context Store for Evolutionary Architecture

AI makes the first 80% of development feel fast, but hides architectural complexity until it's too late. To prevent system ...
Tom's Hardware on MSN

Researchers turn HBM on its side to tackle AI memory’s heat wall

Researchers in Korea and Japan have proposed sideways-stacked DRAM designs that could push future AI memory beyond ...