Abstract: For high performance microelectronics and MEMS packaging, ceramic-based packages are preferred over plastics. There are a number of ways that ceramic-to-metal joining is of important concern ...
This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. Packaging color changes how potent a product seems to consuimers. The packaging industry has ...
Abstract: This article presents an integrated dual-directional coupler chip operating from 300 MHz to 145 GHz, together with a dedicated packaging solution for seamless connection to 1.0- and 0.8-mm ...
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