Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).

A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced packaging challenges.

Atomic-scale defects in crystals can make excellent quantum memories that can be written and read out using lasers, and could form the basis of future quantum communications and computing systems.

An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...

Hidden semiconductor defects often pass inspection but fail later in operation. Learn how latent defects form, evade ...

Defects can fundamentally alter the physiochemical, optical, thermal, mechanical, and electronic properties and their coupling in functional materials. Numerous possibilities exist for defect ...

To further shrink electronic devices and to lower energy consumption, the semiconductor industry is interested in using 2D materials, but manufacturers need a quick and accurate method for detecting ...

Scientists have found a promising new way to manufacture one of industry’s toughest materials—tungsten carbide–cobalt—using advanced 3D printing. Normally, producing this ultra-hard material requires ...