Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: Row-column addressed 2D ultrasonic transducer arrays require fewer connections compared to their fully addressed counterparts. This allows easier integration with electronics and convenience ...
CCTV captured this (completely fake) conversation between President Donald Trump and a grocery store clerk yesterday. CLERK: That’ll be $286.47, Mr. President. TRUMP: Did you swipe my customer rewards ...
Closed-circuit TV captured this (completely fake) conversation between President Donald Trump and a grocery store clerk yesterday. CLERK: That’ll be $286.47, Mr. President. TRUMP: Did you swipe my ...
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