In the vast reaches of the semiconductor cosmos, a silent menace lurks—one that can obliterate years of design work in a fraction of a nanosecond. Electrostatic discharge (ESD) verification stands as ...

Abstract: The paper explores approaches to the joint use of architecture patterns and safety case patterns in the development of automotive systems. Development processes related to "agile" life cycle ...

Abstract: With the increase of output power and temperature, traditional package technology for AC-DC chips, such as dual inline-pin (DIP) package, can no longer be used in high-power density adapters ...