Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...

The Next Enterprise Won't Just Use AI—It Will Own Its Intelligence

If enterprises want to retain control over the intelligence their systems create, governance has to be built into every layer ...
Tech Xplore on MSN

AI memory bottleneck may ease as ultrathin chip stacks quadruple high-bandwidth memory density

A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor ...
Tom's Hardware on MSN

JEDEC releases new SPHBM4 standard to slash AI memory costs

Cheaper HBM-class memory.
MIT Technology Review

IBM has unveiled chip technology that could help extend Moore’s Law another decade

The company, along with others, is pursuing a new paradigm for cramming more transistors on chips—building up.
IEEE

28 GHz Doherty Power Amplifier in CMOS SOI With 28% Back-Off PAE

Abstract: A single-stage, symmetric Doherty power amplifier (PA) in 45 nm CMOS silicon on insulator at 28 GHz is presented. The PA achieves a saturated output power of 22.4 dBm, a peak power added ...