Inside China’s robotics revolution

How close are we to the sci-fi vision of autonomous humanoid robots? I visited 11 companies in five Chinese cities to find out ...
Semiconductor Engineering

All AI Data Center Interconnects Will Be Optical Within 5 Years

InP and SiPho join CMOS as critical technologies. Lasers, CPO and OCS will be everywhere (indium phosphide, silicon photonics ...
unr.edu

University of Nevada, Reno

At the University of Nevada, Reno, we believe in the power of purpose and the strength of the Pack. Whether you're engineering clean energy, studying literature’s role in social change, or designing ...
IEEE

High-Gain 2×1 Rectangular Microstrip Patch Array with Double-Reflector DGS for Long-Range (LoRa) Communication

Abstract: Communication technology is developing rapidly, including the use of Internet of Things (IoT) technology for long-distance communication. One of the IoT modules currently being developed is ...
IEEE

Highly Consistent, Miniaturized Transverse Wave Ultrasonic Transducer Array Based on 147° Orientation in X-Cut Lithium Niobate for High Resolution Imaging

Abstract: Transverse waves offer shorter wavelengths and higher spatial resolution than longitudinal waves at identical frequencies, providing advantages for solid nondestructive testing (NDT).
GitHub

stb_rect_pack.h

// Useful for e.g. packing rectangular textures into an atlas. // Does not do rotation. // Not necessarily the awesomest packing method, but better than // the totally naive one in stb_truetype (which ...