Abstract: Advanced packaging solutions for wide bandgap power devices, such as silicon carbide (SiC) MOSFETs, can help realize their full potential. Additively printed electronics present a promising ...
While 2025 was dominated by AI discussions (and fears), there were actually some really great bright spots in the traditional ...
Abstract: In this article, an innovative layout is introduced to reduce the stray inductance of the multichip power modules (MCPMs) through reverse coupling of current in parallel power loops, which ...
Global energy demand is rising rapidly, driven by data centers, advanced vehicles, and new manufacturing technologies. Researchers at NREL have developed an ultra-efficient, compact power module that ...