Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...
Abstract: Given the prospects of the low-altitude economy (LAE) and the popularity of autonomous aerial vehicles (UAVs), there are increasing demands on monitoring flying objects at low altitude in ...
We describe a concrete device roadmap towards a fault-tolerant quantum computing architecture based on noise-resilient, topologically protected Majorana-based qubits. Our roadmap encompasses four ...
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