Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...

Cadence rolls out AI agent to speed circuit board, chip packaging design

By Stephen Nellis SAN FRANCISCO, July 15 (Reuters) - Cadence Design Systems on Wednesday launched an artificial-intelligence ...

How generative AI and physics can help design new antibiotics

By 2050, scientists estimate that antibiotic-resistant infections will be associated with more than eight million deaths ...

OpenAI and Broadcom announce chip designed for LLM inference at scale

OpenAI, the company behind ChatGPT and Codex and the models those tools use, and Broadcom, an established silicon supplier, have announced a new chip, called Jalapeño, designed specifically for large ...

OpenAI unveils first custom AI inference chip, Jalapeño, with Broadcom — and its development was sped-up with OpenAI's own models

The companies attributed this speed to a deep software-hardware co-development process that actively used OpenAI’s own models ...
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