As AI, high-performance computing, cloud workloads, and data-intensive enterprise applications continue to scale, server memory systems are under growing pressure to deliver more bandwidth, higher ...

Heterogeneous integration does not simply increase complexity but redistributes where quality must be assured.

HBM is a reliability bottleneck, requiring greater visibility into individual bonds and TSVs, and more sophisticated SI/PI ...

OpenAI is developing its own AI accelerator using Broadcom. Anthropic is also rumored to be exploring doing its own chip. As the developers of the most popular frontier models, one can expect they’ll ...

A smaller set of fiber connectors that meet manufacturing test high insertion count will ease the cost burden for all. Test specifications and associated standardized test formats will facilitate data ...

Researchers from the University of Hong Kong, Fudan University, and National University of Singapore designed an analog content-addressable memory (CAM) utilizing 2D molybdenum disulfide (MoS 2) flash ...

Technical Paper Research Organizations; Ultrafast switching of optical properties in a doped semiconductor by intense femtosecond laser pulses: Imperial College London, University ...

Both approaches scale toward packages as large as 240 mm x 240 mm, with a roadmap extending beyond 12x reticle integration ...

An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible ...

As packages get larger and thinner, warpage is becoming a process-control problem rather than a simple flatness spec.

Explore how designers can build safer, smarter humanoid robots-covering motor control, main compute, zone control, battery management, charging and sensing. Download the application presentation to ...

Compute clusters offer more processing capacity but at the cost of higher power. Software is needed to allocate resources ...