A form of reflow AI has been available for many years. It has now grown up and become more powerful. MAX tells us that AI is ...

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the ...

One high-volume OEM proves that even simple feedback from an AOI system can reduce end-of-line defects by an order of magnitude. Until recently, the use of pre-reflow optical inspection usually was ...