Researchers in Germany have developed a laser-based method that can seal paper packaging by fusing wood-derived fibers ...

The Papure project turns existing paper compounds into a natural adhesive, creating highly recyclable packaging. is a senior ...

Snack manufacturers look to incorporate digital controls and high-tech automation to reduce the costs of their packaging ...

There are two key points in the lifecycle of food packaging where sustainability gains can be made: end-of-line and ...

Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond. Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more ...

SCOTTSDALE, Ariz.--(BUSINESS WIRE)--N2 Packaging Systems, LLC (“N2 Packaging”) is the holder of various patents within the United States, Canada and other international markets relating to its ...

Ultra-thin and energy efficient displays that use organic compounds to emit light have been stirring up excitement in the consumer electronics industry for several years. Researchers have now ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...