GUC engineers are using Ansys HFSS 3D Layout’s advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...

FOUNTAIN INN, S.C., March 28, 2023 (GLOBE NEWSWIRE) -- KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better ...

Direct links to simulation models for 13 of Kyocera AVX’s embedded antennas are available in Ansys HFSS 3D electromagnetic simulation software. As part of Ansys 2023 R1, models include embedded FR4 ...

Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...

SynMatrix is now integrated with Ansys HFSS™ to reduce design time by over 50% for applications including 5G, aerospace and defense, satellite communications, and radar The joint solution empowers ...

QuantalRF, the pioneering developer of RF semiconductor and antenna solutions, today announced its DockOn® antennas are now ...

Ansys is looking to help engineering teams to mesh and solve larger designs with the launch of Ansys HFSS Mesh Fusion, cutting development costs and speeding up the development of leading-edge ...

What you can see when you add hundreds of processing cores and terabytes of coherent share memory for EM field simulations. This white paper discusses how the latest version of ANSYS HFSS (Release 16) ...

Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...

With the newly launched Ansys 2021 R2, engineers can capitalize on ever-increasing computing power to optimize complex products, assemblies and systems across industries. Ansys 2021 R2 enables ...