A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...

Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...

This study is led by Prof. Shuangyin Wang (College of Chemistry and Chemical Engineering, Hunan University) and Prof. Chen Chen (College of Chemistry and Chemical Engineering, Hunan University).

Hidden semiconductor defects often pass inspection but fail later in operation. Learn how latent defects form, evade detection, and drive long-term reliability failures.

An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...

Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...

Atomic-scale defects in crystals can make excellent quantum memories that can be written and read out using lasers, and could form the basis of future quantum communications and computing systems.

(Nanowerk News) Metal-organic framework (MOF) nanocrystals are hybrid materials, built from metal clusters and organic linkers with an almost unlimited number of possible combinations. Their ...

Korean researchers have found that the defects limiting silicon heterojunction solar cells (SHJ), the ...